The EE Department is housed in the Engineering Building II (ENB) which provides excellent research facilities and computing capabilities.

Laboratories include:

• A MEMS design and fabriction lab
• A wide bandgap Sic Facility
• Compound semiconductor materials processing and microfabriation facilities with MOCVD reactors and CVD and plasma processing equipment; thin-film and hybrid circuit facilities;
• Extensive semiconductor characterization equipment (DC through optical, including a semiconductor parameter tester, a network analyzer, a scanning electron microscope, a deep-level transient spectroscope and electrochemical profilers and beam characterization tools);
• A communications and signal processing laboratory focusing on integrated-services (data/voice/video) telecommunications, information transport networks, VLSI and microprocessor-based algorithm implementations, speech and image processing, and digital communications;
• A Restructurable VLSI lab;
• CAD and modeling laboratories for analog digital and microwave monolithic circuits and devices, as well as antennas and scattering characteristics. The VLSI CAD facility includes extensive software and an automated system.
• Robotics and intelligent machines lab
• Surface Science Laboratory. The laboratory features a photoemission spectroscopy set-up with integrated preparation facilities for macro- molecular materials (nanoparticles, polymers bio-molecules), metals and semiconductors